Engineering Technician, Photolithography (Night Shift)

Key Responsibilities : Semiconductor visual die inspection to ensure MIL-STD 883 and customer specification compliance. J ob Responsibilities: Heavy use of microscope and other die inspection tools Handles semiconductor wafers and die Visually inspects to customer criteria and MIL-STD – die level (commercial, Class S, Class K as required) Familiarity with AOI, die sorting equipment (manual, semi and full auto) Capable of binning defects Capable of interpreting wafer map Familiarity with FOD , contamination and ESD management Disposition the material based on the specification and criteria approved Generate defect images and pareto charts (Excel use) to provide feedback to upstream processing (closed loop feedback) Attend meeting s to provid e yield data and contribute to defect root cause analysis and potential corrective actions Skills: Must be able to sit for a long period of time. Must be able to work under a microscope for an extended period of time – optical and digital Must pay attention to details, being meticulous. Must be well-organized and detail oriented Must know MIL-STD 883 details and learn customer specific requirements