Package Development Engineer

Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, reliable, and cost-effective products.

• Lead package development activities from concept, design, qualification, and production release.
• Develop and optimize substrate-based and leadframe-based flip-chip package technologies.
• Drive package architecture, material selection, assembly process development, and manufacturability improvements.
• Support flip-chip integration, including bumping, underfill, reflow, molding, and singulation process optimization.
• Develop qualification plans and assess package reliability performance.
• Lead root-cause investigations and corrective actions for package, assembly, and reliability issues.
• Collaborate with OSATs and suppliers on process development, yield improvement, and cost reduction initiatives.
• Support NPI execution and transfer technologies into high-volume manufacturing.
• BS/MS in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 8+ years of semiconductor package development experience.
• Strong expertise in:
• Flip-chip packaging technologies
• FC-BGA and FC-LGA packages
• FC-QFN, FC-DFN, DrMOS, and SPS packages
• Leadframe and substrate packaging processes
• Package reliability and qualification
• Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies.
• Experience working with OSATs, substrate suppliers, and material vendors.
• Strong technical leadership and project management skills.
• Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
• Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
• Proven ability to lead projects across organizations and cultures in a fast-paced environment.