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扩散工艺研发专家/主任工程师-TD Diff Process Expert/Staff Engineer(J19739)
ChangXin Memory (CXMT) · 安徽省·合肥市
About The Role
- 1.工艺实验设计与优化: 主导扩散工艺(氧化、退火、掺杂等)的实验设计(DOE),优化温度、时间、气体流量等关键参数,提升工艺均匀性与器件电学性能,解决掺杂浓度偏移与颗粒污染问题;
- 2.新型工艺模块开发: 主导新型扩散工艺模块的预研与开发,对标制程节点需求评估工艺窗口,推动新工艺从实验验证到量产转移的完整闭环;
- 3.缺陷根因分析与改进: 主导扩散工艺相关缺陷(氧化层质量偏移、掺杂不均、颗粒污染等)的根因分析,制定并实施工艺改进措施,闭环解决研发及量产中的关键问题;
- 4.跨团队协同优化: 拉通整合、量测与器件团队,建立扩散工艺参数与器件电性能的关联模型,为器件设计与工艺窗口优化提供数据支撑;
- 5.技术规范与团队建设: 制定扩散工艺规范与控制标准,撰写技术文档与专利,主导团队工艺能力建设与经验沉淀。
- 1.教育背景与专业知识: 硕士及以上学历,材料科学/化学工程/物理/微电子等理工科专业,具备扩散机理、掺杂动力学及半导体器件物理的专业知识;
- 2.专业技能与资格: 能独立设计并执行DOE实验,使用扩散炉管等设备完成工艺调试,运用JMP或Python完成实验数据分析与工艺参数建模;
- 3.行业与专业经验: 具备8年以上半导体扩散工艺研发经验,有完整节点工艺开发和量产转移的成功案例者优先;
- 4.项目/任务成果: 主导过至少2个扩散工艺开发或优化专项,成功解决关键厚度均匀性、掺杂浓度偏差或颗粒缺陷问题,形成标准化工艺文档并成功应用;
- 5.其他要求: 具有创新思维与复杂技术攻坚韧性,具备跨团队协作与项目管理能力,能在多任务并行中保持严谨高效。
- 引用
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