Sr. Process Engineer, Wet Etch

We are building Terafab, a vertically integrated semiconductor factory at an unprecedented scale. The facility houses logic, memory, packaging, test, and lithography mask production under one roof, optimized for rapid iteration and maximum compute density per square foot. Process engineering is where Terafab technology gets built, atom by atom, and wet etch is where precision meets chemistry. You will develop and own wet clean and etch processes across three distinct chip families: edge-inference processors, space-hardened chips for orbital satellites, and high-bandwidth memory.

• Develop and qualify wet etch and wet clean processes for critical applications including oxide, nitride, silicon, and metal layer removal
• Own bath chemistry formulation, concentration control, temperature management, and process window optimization for both isotropic and selective wet etch steps
• Develop and qualify post-etch and post-CMP wet clean processes including single-wafer spin clean, megasonic, and dilute chemical clean steps
• Qualify wet process tools from installation through production readiness, including bench qualification, process chamber seasoning, and particle/defect control
• Analyze processes from a first-principles, physics-based approach to understand and manipulate mechanisms, not just recipes
• Lead root cause analysis, establish inline metrology and SPC control strategies, and drive systematic yield improvement
• Support 24/7 manufacturing operations through rotations, on-call availability, and rapid response to critical production issues
• Drive next-generation wet chemistry formulations and process development
• BS or MS in Chemical Engineering, Materials Science, Electrical Engineering, Chemistry, or related technical field
• 5+ years of hands-on wet etch process engineering experience in a semiconductor fab, especially ＜7nm in a logic, memory, or foundry environment
• Deep experience with wet bench qualification, wet clean process development, and process of record (POR) establishment at advanced nodes
• Proficiency with wet process metrology tools: particle counters, defect inspection, film thickness measurement, and surface analysis techniques
• Strong DOE skills and statistical analysis capability (JMP, Python, or R)
• Ability to work closely and proactively across lithography, etch, thin films, integration, and equipment engineering teams

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