Sr. Process Engineer, Thin Films - Dielectric

We are building Terafab, a vertically integrated semiconductor factory at an unprecedented scale. The facility houses logic, memory, packaging, test, and lithography mask production under one roof, optimized for rapid iteration and maximum compute density per square foot. Process engineering is where Terafab technology gets built, atom by atom, and dielectric films set the foundation for device performance.

• Develop and qualify ALD, CVD, and PECVD processes for gate dielectrics, high-k materials, inter-layer dielectrics (ILD), and spacer films at 2nm-class nodes
• Characterize dielectric film properties—thickness, k-value, leakage, breakdown voltage, conformality, and stress
• Own development for high-k gate dielectrics (HfO₂, HfZrO) and low-k ILD films from tool installation through HVM handoff
• Qualify deposition tools from installation through production readiness, including chamber matching, particle control, and process window qualification
• Analyze processes from a first-principles, physics-based approach to understand and manipulate mechanisms, not just recipes
• Lead root cause analysis, establish inline metrology and SPC control strategies, and drive systematic yield improvement
• Support 24/7 manufacturing operations through rotations, on-call availability, and rapid response to critical production issues
• Drive next-generation dielectric materials and process development
• BS or MS in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related technical field
• 5+ years of hands-on thin films process engineering experience in a semiconductor fab, especially ＜7nm in a logic, memory, or foundry environment
• Deep experience with ALD/CVD tool qualification (Applied Materials, Lam, ASM, or Tokyo Electron), dielectric process development, and process of record (POR) establishment at advanced nodes
• Proficiency with thin films metrology tools: ellipsometry, XRF, TEM, CV/IV characterization, film stress measurement, and defect inspection
• Strong DOE skills and statistical analysis capability (JMP, Python, or R)
• Ability to work closely and proactively across lithography, etch, thin films, integration, and equipment engineering teams

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