← Back to job listings
CM
新产品后道管理主任工程师-NPM Staff Engineer(J19559)
ChangXin Memory (CXMT) · 安徽省·合肥市
About The Role
- 作为后道工程代表参与新项目开发流程建设,输出后道相关活动及交付成果;
- 组织成立项目后道内部管理团队,评估封测运营方式并推动实施;
- 识别开发中影响量产的问题,联动各部门推动解决;
- 评估产能计划,支持产能爬坡,确保量产交付节奏;
- 推动设备效率、产品良率、测试时间等关键指标达成,保障量产质量与效率。
- 1.本科及以上学历,集成电路、工业工程等理工科相关专业;
- 2.8年以上半导体行业经验,具备封装/测试流程或逻辑芯片制造后段运营经验者优先;
- 3.熟悉封装/测试基本流程,了解逻辑芯片制造过程;
- 4.自我驱动力强,主动识别问题并推动解决;
- 5.责任心强,对产品量产交付结果负责;
- 6.逻辑清晰、沟通能力强,能高效串联跨部门协作。
Similar roles you might like
See all →8I
Physical AI Solutions Architect
891 Intel Mobile Communications Technology (Shanghai) Ltd.
Salary not disclosedPosted today
L
Firmware Engineer
Lattice
Salary not disclosedPosted today
LC
Staff Embedded Software Engineer
Lattice China (Shanghai)
Salary not disclosedPosted today
YA
CMF/Color Developer
YETI Asia Private Limited
Salary not disclosedPosted today
1S
Software Engineering & Development, Off(AI)
1339 SS TECH (ZHEJIANG) CO LTD
Salary not disclosedPosted 1 day ago
R
Sr Firmware Engineer
Resideo
Salary not disclosedPosted 2 days ago
A
QA Specilist
abb
Salary not disclosedPosted 2 days ago
TC
Senior Software Governance Engineer
TELVENT CONTROL SYSTEM (CHINA) CO., LTD
Salary not disclosedPosted 2 days ago
This is an external listing. JobSpring does not represent or verify the employer. Report this listing