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封装设计工程师-Packaging Design Engineer(J18499)

ChangXin Memory (CXMT) · 上海市

Other EngineeringImported listingfull-time5 months ago

About The Role

  1. 封装方案选型与设计：根据MRD、产品性能要求及工艺能力，主导封装方案选型，使用EDA工具完成PKG基板设计与芯片设计；
  2. 早期封装可行性评估：对新器件进行早期封装可行性评估，并向相关部门反馈优化建议；
  3. 工程图纸设计：使用设计工具完成POD、Wirebonding及Marking图纸的绘制；
  4. Daisy Chain设计：使用EDA工具完成Daisy Chain PKG及PCB设计；
  5. Bump与Ball Map优化：主导Bump设计与优化，开发并优化Ball Map方案；
  6. 基板厂协同与量产规范：与基板厂紧密协作，确保新设计规则满足量产要求与高性能目标。
  7. 教育背景与专业知识：本科及以上学历，电子工程、微电子、材料科学、机械工程或相关专业；
  8. 专业技能与资格：能使用EDA工具完成PKG基板与Daisy Chain设计，能使用设计工具完成POD、Wirebonding及Marking图纸绘制；
  9. 行业与专业经验：具备封装设计或基板设计经验，有与基板厂协同推动量产的经验者优先；
  10. 其他要求：具有跨部门沟通协作能力，能推动设计方案落地。

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