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异构集成设计工程师-Heterogeneous Integration Design Engineer(J18206)
ChangXin Memory (CXMT) · 安徽省·合肥市
About The Role
- 主导 HB(1+1 F2F) 和 CoW 1+1 HB 的 align/OVL/bonder tree 及标记设计,优化工艺精度;
- 制定逻辑框架(logic frame)布局规则,完成 T/O 技术调研表(T/O survey form)输出;
- 设计 TEG(testkey)、Seal ring、TTV/THK pad 及切割路径(dicing design),确保芯片物理可靠性;
- 开发 frame/chip dummy 填充方案,提升可制造性(DFM)与良率;
- 设计 TV spider mask 并主导 MV 产品掩模就绪(mask readiness)全流程;
- 执行 GDS/JDV 校验报告(check report),确保设计数据与工艺匹配性;
- 跨部门协同与技术规范文档梳理。
- 硕士及以上学历,微电子/材料/机械工程专业;
- 3年以上异构集成设计经验,熟悉 CoWoS异构集成技术;
- 熟悉OVL/bonder mark 设计规范与TEG 结构设计及切割工艺仿真;
- 熟练掌握光刻掩模(spider mask)设计流程和GDS 物理验证与 JDV 调试;
- 思维开阔,有创新精神。
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