ENGR STAFF, PACKAGE DEVELOPMENT

New package development -from conceptualization and ideation to creation of fully functional prototypes. Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers) Physically conduct POC builds and/or technology demonstration with Provider Benchmark processes/technologies Provides POC development costing and project timing Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow Make sure we are covered with the Intellectual Property prior engagement Generate/Present POC and/or Technology demonstration reports to Stakeholders Technology Transfer to development site Provides intelligence on Package Technology/Market Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions. Provides recommendations regarding technical approach or design, resource allocation, or project timing. Works with general guidance but independently determines the best approach for solving a problem. Conducts Design reviews and risk assessments with participation by other technical experts Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.

Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development Hands-on assembly development and manufacturing experience. Analytical skills: process, materials and assembly equipment parameters Hands-on experience in program management