System & Advanced Packaging Design Lead

<p><strong>Role Overview</strong></p>
<p>We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and drive the development of complete solutions for data-centers</p>
<p><strong>Key Responsibilities</strong></p>
<p><strong>Technical Leadership & Execution</strong></p>
<ul>
<li>Own package, PCB, and system-level signal integrity architecture for 200G+/lane copper interconnects (C2M, C2C, and cable assemblies) — from channel budgeting and topology definition through post-layout signoff and correlation with silicon measurements.</li>
<li>Drive 2.5D/3D and heterogeneous package development for co-packaged driver, TIA, and optical engines, including substrate architecture, interposer/bridge evaluation, and die–package co-design with the SerDes and analog design teams.</li>
<li>Lead micro-LED and photonic packaging development: optical coupling and alignment strategy, hermeticity and reliability, and thermal co-design with the optical engine.</li>
<li>Define and manage the OSAT and substrate supplier strategy — technology selection, DFM reviews, JEDEC qualification, yield ramp, and HVM readiness.</li>
<li>Own package-level power integrity and thermal strategy: PDN targets, decoupling plans, lid/TIM selection, and clear signoff criteria across programs.</li>
<li>Coordinate cross-functional execution across silicon design, product/test engineering, systems hardware, and manufacturing partners; run design reviews and manage schedule and risk.</li>
</ul>
<p><strong>Hands-On Design</strong></p>
<ul>
<li>Personally drive substrate stackup definition, ballmap/pinmap optimization, and high-density breakout and escape routing studies for high-speed designs.</li>
<li>Perform 3D EM extraction and channel simulation (HFSS/Q3D, ADS or equivalent), S-parameter quality checks, and COM/IL/RL budgeting against IEEE 802.3 and OIF-CEI specifications.</li>
<li>Build and correlate PDN and thermal models spanning die, package, and board.</li>
<li>Lead lab characterization: VNA/TDR measurements, BER and eye-margin testing, model-to-measurement correlation, and failure analysis support.</li>
<li>Author package design guidelines, review checklists, and reference collateral used across product programs.</li>
</ul>
<p> </p>
<p><strong>Required Qualifications</strong></p>
<p><strong>Education & Experience</strong></p>
<ul>
<li>Ph.D. in Electrical Engineering (or related) with 5+ years, OR M.S. with 8+ years of Advanced package development in high volume.</li>
<li>Proven experience leading teams to successful execution, with multiple products delivered in advanced CMOS nodes.</li>
</ul>
<p><strong>Core Technical Skills</strong></p>
<ul>
<li>Deep SI/PI expertise for multi-GHz serial links: 112G/224G PAM4 channel design, COM analysis, crosstalk and mode-conversion control, and connector/cable interfaces.</li>
<li>Advanced packaging depth: FCBGA, RDL/fan-out, 2.5D interposers and silicon bridges, substrate design rules, and materials selection.</li>
<li>Fluency with industry tools: HFSS, Q3D, SIwave/PowerSI, ADS channel simulation, Cadence APD/Allegro (or equivalent), and thermal tools such as Icepak or FloTHERM.</li>
<li>Reliability and qualification: JEDEC standards, moisture sensitivity, thermo-mechanical stress, and warpage/coplanarity management for large-body packages.</li>
<li>Working knowledge of optics packaging: VCSEL/PD or silicon-photonics co-packaging, fiber and lens coupling, and active alignment concepts.</li>
</ul>
<p> </p>
<p><strong>Leadership & Program Skills</strong></p>
<ul>
<li>Track record leading small internal teams and external partners (OSATs, substrate vendors, contract labs) through complete product cycles into volume production.</li>
<li>Strong program discipline: schedule and risk management, structured design reviews, and clear documentation in a fast-moving environment.</li>
<li>Excellent cross-functional communication with silicon, systems, and executive stakeholders; comfortable presenting technical trade-offs to customers and partners.</li>
</ul>
<p> </p>
<p><strong>Preferred Qualifications</strong></p>
<ul>
<li>Experience with co-packaged optics, linear-drive optics, or active copper/electrical cable (ACC/AEC) products.</li>
<li>Micro-LED, VCSEL, or photonic device packaging experience.</li>
<li>Familiarity with UCIe and chiplet/die-to-die interconnect packaging.</li>
<li>Hands-on HVM ramp experience at leading OSATs (ASE, Amkor, JCET, or similar).</li>
<li>Prior startup experience or comfort operating with broad scope under resource constraints.</li>
</ul><div class="content-pay-transparency"><div class="pay-input"><div class="title">California Pay Range</div><div class="pay-range"><span>$180,000</span><span class="divider">—</span><span>$200,000 USD</span></div></div></div>