Wirebond & Die Attach Process Engineer (MES Project)

Change the world. Love your job.
Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

Key Responsibilities:

• MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.
• Control & Exception Handling: Design the digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition.
• Alignment & Validation: Align requirements between manufacturing and quality teams. Validate proposed digital workflows and support UAT and deployment.
• Sustaining (Post-Project Phase): Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework.

Minimum requirements:

• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• Strong hands-on semiconductor process experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience
• Strong foundation in statistical process control, engineering change control and process release strategies

Preferred qualifications:

• Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early
• Experience in optimizing process parameters for wedge bonding or die attach accuracy.
• Demonstrated strong analytical and problem solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result