Process Engineer - Diebond (CoX)

Job Summary: The Process Engineer is responsible for developing, optimizing, qualifying, and sustaining die-bonding processes for Chip on Carrier products. The role ensures that die-bonding operations consistently meet product specifications, yield targets, reliability requirements, and production capacity needs. This role requires close collaboration with Product, Equipment Engineering, Quality, Operations, Suppliers, and global engineering teams to support die-bonding equipment acceptance/qualification, process transfer, yield improvement during ramp and high-volume manufacturing.