Senior Analog Design Engineer

Change the world. Love your job.

Texas Instruments (TI) is out front and ready for the next big challenge. Our innovations are at the core of nearly every electronics product in use today. And it doesn't stop there. We're developing breakthrough technology to power the world's future innovations as well. TI is committed to building a better future — from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. Put your talent to work with us.

This is a great opportunity to be part of an established team that's continuing to look for growth opportunities, working with worldwide leading customers and developing cutting edge solutions in the areas of consumer electronics, mobile computing and communications.

Who are we and what do we do?

The Advanced Circuits and Power Solutions business is known for delivering industry-leading custom IC system solutions, including display and touch power products, charger power products, camera PMICs, power path devices, sensing devices, and high-performance communication interface products. Our products integrate precision signal chains and highly efficient power components into ultra-small form factors, enabling TI’s best-in-class customers to translate their ideas into high-value products that revolutionize the personal electronics market.

In this team, you will work with and learn from incredibly talented technical leaders who have influenced TI’s technology, productivity, and way of working in creative and impactful ways. You will directly interact with one of TI’s most valued, high-volume customers through intense technical reviews and architecture discussions!

By enabling designs that are highly impactful to TI revenue and working with a critical customer on a versatile set of products, you will find yourself on an accelerated career path.

About the job

If you are looking to join an ingenious, vigorous & ambitious team that consistently delivers groundbreaking technologies into the custom mobile electronics world, here is an opportunity for you!

In this role, responsibilities may include

• Participate in the review and sign-off of designs developed within the team as well as other products developed across TI.
• Represent TI's technical leadership in front of leading customers.
• Drive TI's technology roadmap while collaborating with Process, Packaging, EDA, and other stakeholders within and outside TI.
• Define and drive industry-leading best practices within TI.
• Act as an Analog Chip/Sub-section/IP architect and designer, with complete ownership and responsibility from definition to release and manufacturing.
• Direct, guide, and participate in research or technical design functions responsible for designing, developing, modifying, and evaluating electronic parts, components, and integrated circuits for a variety of applications.
• Provide design guidance to team members as needed, developing schedules and monitoring progress throughout the project.
• Evaluate intermediate and final results of projects during the design phase and silicon evaluation to ensure the accomplishment of technical objectives.
• Work with and provide guidance to physical designers, and monitor the progress of IC layout.
• Collaborate with Design Verification teams during the pre-PG phase of a project to ensure completion of all technical tasks before PG.
• Work with systems engineers and application engineers, assisting in the definition of products to meet customer needs.
• Collaborate with validation, product engineering, and test engineering teams to enable a successful transfer to production.
• Interface and lead discussions with customers and/or TI field sales/field applications teams to understand customer designs and problems, and to provide support as required.
• Actively participate in hiring, developing, and evaluating personnel to ensure efficient operation of the organization and the growth of individuals into leaders.

Minimum requirements

• Masters OR Bachelor's degree in Electrical Engineering
• 12 years of relevant experience

Organizational Skills: Ability to work well with internal cross functional teams. Must successfully and appropriately interface with external customers. Project management, time management, multi-tasking, problem solving and communication (written and oral) are important skills in this role. Must be able to manage assigned tasks with minimal supervision.

Team and People Skills: Candidate must be team oriented and must be able to work with TI-internal and external groups (systems, test, sales, marketing, customers, etc.) to resolve issues and generate business success. The ability to work well with others and to perform in a team environment is essential.

Projects and Deliverables: The main deliverable is the timely release of meticulously analysed and simulated IC designs or sub-sections of designs for custom designs with tight schedules. These designs should lead to cost-effective, high quality, bug-free products that fully meet our customer’s end-system requirements.

Preferred qualifications

• Customer Interaction: Active involvement with customers, with a demonstrated sense of ownership when collaborating with customers and all product development team members (including design, layout, systems, verification, validation, test, and program management).
• Architectural Expertise: Proficiency in IC system partitioning, architectural tradeoff analysis, block-level topology selection, hand analysis, and IC transistor-level implementation.
• CAD & Simulation: Expert-level schematic generation and simulation using modern CAD tools (Cadence toolset), including Spectre, Simplis, Matlab, and AMS.
• Advanced Analysis: Expertise in worst-case identification, top-level simulation, Monte Carlo analysis, and simulation data analysis.
• System Integration: Strong system-level understanding and analysis, with the ability to translate requirements into IC-level specifications.
• Physical Design: Experience in physical layout management, including signal grounding, routing tradeoffs, die area optimization, post-layout parasitic extraction, and simulation to verify all IC-level performance metrics.
• Verification: Proficiency in top-level verification, block-level modeling, and top-level simulation.
• Device Physics: Knowledge of device physics and process technology tradeoffs applicable to Power IC design.
• Project Execution: Proven ability to budget time, manage schedules, and complete complex IC design tasks on time with a meticulous approach to ensure high-quality results.
• Design for Manufacturing (DFM): Ability to account for system-level specification limitations, testability, debug, characterization, production, and yield targets during the IC design phase.
• Interpersonal & Leadership:
• Ability to foster a highly creative, interesting, productive, and fun working environment for colleagues and customers.
• Ability to establish strong relationships with key stakeholders, both internally and externally.
• Strong verbal and written communication, interpersonal, analytical, and problem-solving skills.
• Ability to take initiative, drive for results, and quickly ramp up on new systems and processes.
• Strong time management skills to ensure on-time project delivery and effective collaboration across different functions