Technical Module Owner (f/m/x)

ZEISS Semiconductor Manufacturing Technology​

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Enabler for smaller, more powerful, and more energy-efficient microchips​

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Working for tomorrow today. ​

Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.

Your role

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take module ownership for camera components within a high-precision machine for mask metrology

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coordinate interdisciplinary development activities across camera hardware, electronics, firmware & software, metrology algorithms, controls and system integration

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starting from module requirements and interfaces, define design, verification plans and acceptance criteria for camera functionalities and information to be processed and sent to other modules

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plan and steer technical work packages, milestones, risks, dependencies, design reviews, integration steps and documentation deliverables for the assigned modules

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ensure technical consistency between camera acquisition, calibration, data handling, metrology processing and machine-level performance budgets

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drive integration, commissioning and issue resolution together with internal experts, suppliers and project stakeholders, ensuring transparent status, priorities and decisions

Your profile

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a university degree in electrical engineering, mechatronics, computer science, physics or a comparable technical field

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technical understanding of camera-based inspection systems, image acquisition chains, calibration concepts, metrology and high-precision machine integration

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experience in coordinating complex module development across hardware, software, algorithms, electronics and metrology disciplines

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good knowledge of requirements engineering, interface management, verification planning, error budgeting, technical risk management and structured decision preparation

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strong project coordination skills, including milestone planning, dependency tracking, stakeholder alignment, backlog prioritization and escalation of technical impediments

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experience working with suppliers and internal development partners on camera hardware, test setups, prototype builds, data flows, commissioning and troubleshooting

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very good communication skills in English and German

Your ZEISS Recruiting Team

Janina Kalmbach