Package / Process Development Engineer at Hctz — Carmona

About The Role

Lead R&D initiatives focused on die preparation processes like but not limited to laser groove / ablation, mechanical dicing, stealth dicing.
Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
Design and conduct experiments to develop and refine packaging processes.
Analyze experimental data to identify trends and optimize process parameters.
Develop comprehensive process documentation and control plans.
Address and resolve complex process-related challenges.
Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
Mentor and provide technical leadership to junior engineers and team members.
Ensure all R&D activities comply with industry standards and company policies.
Education
Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
Experience
Minimum of 8 years of experience in semiconductor package assembly process development.
Experience in Project Management is a plus.
Skills
In-depth knowledge of wafer singulation processes, semiconductor packaging technologies and materials.
Proven track record in process development and efficient use of methodologies.
Strong analytical and problem-solving skills.
Excellent communication and collaboration abilities.
Familiar with Project Management concepts and tools.