ENGR STAFF, PACKAGE DEV : PKG & ASSY at Hctz —

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About The Role

Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers)
New package development -from conceptualization and ideation to creation of fully functional prototypes
Physically conduct POC builds and/or technology demonstration with Provider
Benchmark processes/technologies
Provides POC development costing and project timing
Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow
Make sure we are covered with the Intellectual Property prior engagement
Generate/Present POC and/or Technology demonstration reports to Stakeholders
Technology Transfer to development site
Provides intelligence on Package Technology/Market
Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions.
Provides recommendations regarding technical approach or design, resource allocation, or project timing.
Works with general guidance but independently determines the best approach for solving a problem.
Conducts Design reviews and risk assessments with participation by other technical experts
Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing
Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.
Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering
8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development
Hands-on assembly development and manufacturing experience.
Analytical skills: process, materials and assembly equipment parameters
Hands-on experience on program management