Engineer, Packaging Developing Engineering

• SIP assembly process and packaging engineer, BGA/LGA products packaging, especially for molding process.
• Develop and optimize new process recipes to achieve high capability for future products.
• Evaluate and introduce advanced packaging process technology.
• Collaborate with material/equipment team to develop new material/equipment technology.
• Work with the global team on new product design, evaluation, and introduction.
• Partner with the Pathfinding team to achieve leading PKG technology targets.

REQUIRED

• Master or above, major in Organic Materials Science and Engineering, materials chemistry, etc. 
• Good communication skill and team work spirit, willing to work under certain pressure.

PREFERRED

• Strong Knowledge at SIP packaging.    
• Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (Or other similar statistic software, Spot-fire) etc.
• Familiar with one of programming language will be a plus.

SKILLS

• Good communication skill at both Chinese and English.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email hidden] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.