About The Role

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Location

Tainan,TWN

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .

About EPG (Equipment Product Group)

Equipment Product Group (EPG) is a business unit within Applied Materials' WWO (Worldwide Operations) organization. EPG focuses on the manufacturing, refurbishment, upgrade, and lifecycle support of semiconductor equipment, particularly 200mm and legacy platforms. The team works closely with global customers to improve equipment productivity, extend tool life, and support growing markets.

Key Responsibilities

As a Technical PM role who is responsible for managing and coordinating equipment refurbishment projects , including planning, execution, cross-functional collaboration, schedule management, and ensuring refurbished equipment meets quality, cost, and delivery objectives.
Role requires technical knowledge and experience of EPG 200mm product and structure.
Responsible for core system, audits, and inventory consumption.
Responsible for Core system refurbishment SOW/Delta BOM creation and aligning actual cost to quoted cost.
Schedule and lead core teardown meetings to review Refurb SOW with MFG and other stakeholders.
Utilize Product Structure Tree (PST) database.
Technical Support for Manufacturing, Production Control, Field.
Microsoft Office, SAP, Engineering Change Order experience required
Support cost reduction initiatives/projects for EPG 200mm products.
Helps to prepare project plan and coordinates project activities from planning to implementation. Maintain matrix for process improvements.
Helps to align and track the progress of resources to the business unit to meet project on-time and budget performance objectives.
Coordinates project schedule and task details and helps to prepare reports, tracking charts, checklist and project scheduling.

Qualification

At least 2-4 years of engineering experience in the semiconductor industry. Hardware-related experience is preferred.
Experience with all semiconductor process tools is welcome; MDP, FEP, or Etch is a plus.
English: communication level, with the ability to collaborate effectively in global meetings and cross-functional teams.
Understanding of the secondary semiconductor equipment market.
SAP experience (Multi-level BOM and Where Used queries, ECO research)
Proven project management skills and experience
Travel rate: 25%, mostly in APAC

Additional Information

Time Type

Full time

Employee Type

Assignee / Regular

Travel

Yes, 25% of the Time

Relocation Eligible

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.