About The Role

DescriptionJob Overview

This Industrial Engineering Capacity Engineer will partner with multiple Asian OSAT manufacturing sites. The role oversees full lifecycle management of outsourced production capacity covering the complete semiconductor backend process: wafer bumping, wafer CP test, packaging and final test. Key focus includes early intervention in NPI capacity design, capacity evaluation, matching, monitoring, optimization and manpower allocation, to guarantee outsourced capacity reliably meets all production demands.

Key Responsibilities

Collaborate closely with OSAT IE and Planning teams to conduct end-to-end capacity analysis for wafer bumping, CP test, packaging and final test. Calculate standard machine capacity, assess actual effective line output, and optimize equipment & manpower allocation to remove cross-process bottlenecks.

Coordinate with internal Planning, R&D and Sustaining teams to address capacity-limiting issues (unplanned downtime, material shortage, yield loss) and secure stable outsourced capacity supply.

Compile outsourced capacity reports; forecast short & long-term equipment and manpower demands to support production scheduling and capacity reservation.

Perform regular line load reviews and capacity audits; propose capacity expansion/reduction and manpower adjustment plans to satisfy medium & long-term order volumes.

Spot high-risk stations and capacity shortages across bumping, CP, packaging and final test lines at an early stage. Take proactive intervention and submit formal capacity forecasts & demand requests to OSAT for resource pre-allocation.

Join new product early NPI capacity design. Carry out full-flow capacity pre-assessment and resource planning for outsourced bumping, CP, packaging and test lines to ensure capacity readiness for mass production ramp-up.

Track real-time OEE, production losses and man-hour waste of outsourced lines, monitor capacity utilization, and launch continuous improvement projects to raise overall throughput.

QualificationsBasic Requirements

Bachelor’s degree in Industrial Engineering, Mechanical Engineering, Electronic Engineering or related majors.

Mandatory hands-on IE experience on outsourced capacity management in semiconductor OSAT factories.

Expertise in capacity modeling, takt time analysis, OEE improvement and line balancing; experienced in NPI capacity design covering wafer bumping, CP test, packaging and final test.

Advanced Excel capabilities to independently complete full-set outsourced capacity statistics and analysis reports.

Excellent cross-department communication skills.

Familiar with full backend semiconductor process and equipment: wafer bumpers, CP testers, die bonders, wire bonders, mold machines and final test systems.