About The Role

External Manufacturing NPI Engineer

Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
Adoption of data analytics and data-driven approach to problem solving and decision making
Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
Participate in quality and process readiness audit to achieve production site readiness
Co-work with operations to drive continuous yield improvement for evolving challenges
Subject Matter Expert to address arising package and assembly challenges
Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable
Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
Good overall understanding of OSAT business landscape and operations
Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
Strong project management skills and multi-stakeholder management
Proficient in statistical analysis methods and familiar with data analytics
Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous