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ENGR II, MANUFACTURING EQUIP; MFG

Hctz · Seremban, Negeri Sembilan, Malaysia

External listingfull-timeabout 1 month ago

About The Role

We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM equipment and front end assembly processes.

Technician Leadership: Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs. Machine Issue Follow-up : Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution. Equipment Maintenance & Calibration : Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime. Process Optimization : Monitor Overall Equipment Effectiveness (OEE),Uptime,production time. Documentation : Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.

Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment: Die Bonder : ASM AD838, AD8312PLUS, DA D510, ALPHASAM Clip Bonder : AD830CB, AD830PLUS, BESTEM-C310 Reflow & Ovens : RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System) Screen Printer : ASM DEK Cleaning Systems : CREST, Automated Optical Inspection (AOI) : PENTAMASTER AOI Requirements: Education: Bachelor’s Degree in Mechanical, Mechatronics, Electrical, or Electronic Engineering. Experience: Minimum 3–5+ years of solid engineering experience in semiconductor Front assembly (Die Bond / Clip Bond line preferred). Technical Skills: Expertise in ASM die bond platforms, Solder Phasa bonding mechanisms, and vision systems. Proficient in engineering problem-solving tools (8D, FMEA, SPC, 5-Why, Fishbone). Leadership: Proven track record of managing shift technicians and driving team performance under pressure. Working Hours: Must be willing to support shift teams, handle escalations, and work flexible hours when required.

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