Staff Package Development Engineer

Responsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints. Primarily Wirebond, Die Bond & Mold processes.

Responsible for Developing new assembly technologies such as

• Hybrid Wire Bonding (Al Heavy & Fine Wire Ultrasonic Bonding combined with Cu/PCC & Au Heavy Wire Bonding), Ribbon Bonding.
• Stacked Dice & Bridged Die Bonding on Leadframe Pad and DBC, Clip Bonding
• High CTI, high Thermal, Low Stress Vacuum assisted Molding Technologies
• Responsible for defining package design rules, process flow and material set for new products including automotive power module packages
• Drive alignment between GaN Power Discrete design requirements and supplier capabilities, to enable new product development and volume manufacturing of GaN Power Discrete products
• Run process DOE’s to define optimum process windows and material characteristics on existing assembly processes and for new package development
• Define and Drive reliability testing and qualification of new Power Discrete packages in conjunction with the reliability group
• Work closely with OSATs, Materials & Equipment supplier partners to improve existing processes and to develop new processes for new Products
• Work closely with New Product Definition teams to define packages to meet their requirements
• Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products
• Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production

Job Requirements

BS Degree in ECE, EE, ME, ChemE, CompE, Material Science

15 years of experience in Semiconductor Assembly as Process Engineer, Process Development Engineer & Package Development Engineer : Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and DTFS & Package Singulation

Excellent people & leadership skills and experience in dealing with & managing OSATs for at least 5 years.

Substantial experience in Power Discrete Products with Multi Die & Stacked Die configuration, Ag Sintered Die Bonding, Al, Cu/PCC & Au Wirebonding Technologies and Low Stress Vacuum Molding

Can perform actual hands on Process Capability Analysis & Risk Prediction, Design of Experiments, Variability Charting, Analysis of Variance/Means Comparison/T-Tests from raw data using SAS.JMP or Mini Tab Software. Preferably Green Belt Six Sigma Certified as a minimum

Experience with latest material technologies : Sapphire Substrate Sawing, Conductive & Non Conductive High Thermal Die Attach Film, Ag Sintered Epoxies, Clip Bonding, Ribbon Wire Bonding, High CTI, High Thermal, High Tg, Low Stress, Fine filler Molding Compounds

Experience with IC Packaging design rules, tools (including AutoCAD)

Knowledge of AECQ Automotive reliability requirements, APQP automotive development process, JEDEC Design standards.

Ability to work in a fast-paced, high stress environment with high rates of change

Able to work with people in the US & Europe timezones