Digital Design Engineer

Аbout GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Responsibilities

• Develop, document, and maintain RTL (SystemVerilog/Verilog) for digital subsystems within the CPO product, including control logic, register interfaces, link management, and DFT structures.
• Collaborate with architecture, analog/mixed-signal, and photonics teams to define digital interfaces and control schemes for co-packaged optical modules.
• Own micro-architecture specifications, design reviews, and integration of digital IP into the top-level SoC.
• Drive synthesis, timing closure, CDC, lint, and low-power (UPF) sign-off in coordination with the physical design team.
• Perform FPGA prototyping and testing of digital subsystems to validate functionality, accelerate pre-silicon software bring-up, and de-risk RTL ahead of tape-out.
• Develop and execute UVM-based testing, including building reusable verification components, writing constrained-random tests, and driving functional and code coverage closure.
• Support verification efforts by collaborating with the DV team on testbench development, coverage closure, and debug.
• Participate in tape-out readiness activities, including ECO planning, gate-level simulation, and post-silicon bring-up support.
• Contribute to design methodology, reuse strategy, and quality improvements across the team.

Required Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field.
• 1+ years of experience in digital RTL design using SystemVerilog/Verilog.
• Solid understanding of digital design fundamentals: synchronous design, CDC, FSMs, pipelining, and low-power techniques.
• Hands-on experience with industry EDA tools (synthesis, lint, CDC, simulation).
• Familiarity with scripting (Python, TCL, Perl) for design automation.
• Strong problem-solving skills and ability to work in a cross-functional team.

Preferred Qualifications

• Experience with high-speed serial interfaces (SerDes, PCIe, Ethernet, CXL) or optical link control.
• Exposure to silicon photonics, co-packaged optics, or advanced packaging products.
• Experience with ARM-based SoC integration, AMBA protocols (AXI/AHB/APB), and standard IP integration flows.
• Prior tape-out experience on advanced process nodes.
• Knowledge of UPF/low-power flows and DFT (scan, MBIST, boundary scan).

We Offer

• Base Salary
• Equity
• Annual Bonus Plan
• Medical Insurance

Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/