DCP-PCB Design Engineer(Global)-XA

Power Electonics PCB Design Engineer

Responsibilities

Responsible for the complete PCB design of power supply products across different power levels, including PCB layout, routing, design reviews, and design verification, ensuring high-quality and on-time project delivery.

Collaborate closely with hardware, mechanical, safety compliance, and manufacturing engineers to achieve optimal PCB co-design and continuous design improvements.

Generate PCB manufacturing outputs, including Gerber files and PCBA production documentation; promptly respond to engineering queries (EQs) during manufacturing and maintain proper document archiving.

Continuously follow up on assigned projects throughout debugging, testing, pilot production, and mass production phases; identify, document, and resolve issues to improve product quality and design efficiency.

Participate in the development, maintenance, and optimization of PCB design guidelines, standards, and best practices.

Contribute to fundamental research projects and technology exploration related to PCB design and development.

Qualifications

• Bachelor's degree or above in Electronics Engineering, Electrical Engineering, Automation, or a related discipline.
• Minimum of 2 years of experience in PCB design for switching power supplies, with proficiency in Mentor Graphics tools (such as PADS and Xpedition).
• Strong knowledge of safety compliance requirements, EMC design principles, PCB fabrication processes, and PCBA manufacturing technologies.
• Solid understanding of analog and digital circuit design, with familiarity in common switching power supply topologies and power electronics circuits.
• Strong problem-solving and analytical skills, with the ability to independently complete PCB design tasks.
• Excellent communication and cross-functional collaboration skills, with a strong team-oriented mindset.

Preferred Qualifications

• Experience in PCB design for high-power power supplies, server power supplies, chargers, adapters, or related products.
• Familiarity with high-speed signal routing, EMI/EMC optimization, and thermal design techniques.
• Knowledge of DFM (Design for Manufacturability) and DFA (Design for Assembly) methodologies.
• Familiarity with IPC standards and international safety certification requirements.