电子工程师 E/E Eng.（长春）

Your key responsibilities Global job name: E/E Eng. 1. Responsible for the full process research and development of hardware for products such as nitrogen oxygen/MEMS pressure sensors/two wheel ECUs, including requirement analysis, hardware solution design, schematic drawing, component selection, and outputting hardware design documents that meet mass production standards; 2. Lead PCB layout review, collaborate with layout engineers to complete PCB routing, control EMC/EMI, signal integrity (SI), power integrity (PI) design specifications, and ensure hardware manufacturability and testability; 3. Responsible for welding, debugging, testing, and problem localization of hardware samples, including single board testing, joint debugging testing, resolving hardware failures during the R&D and trial production stages, and outputting test reports and problem rectification plans; 4. Collaborate with embedded software engineers to complete HSI, structural engineers to complete HMI, and collaborate to complete system integration debugging, ensuring compatibility between hardware, software, and structure, and promoting the landing of products from samples to small batch trial production and mass production;. 5. Responsible for the design and testing of EMC/EMI electromagnetic compatibility, as well as debugging related issues and outputting corrective reports; 1.负责氮氧/MEMS压力传感器/两轮ECU等产品硬件全流程研发，包括 需求分析、硬件方案设计、原理图绘制、元器件选型 ，输出符合量产标准的硬件设计文档； 2.主导 PCB Layout评审，协同 layout 工程师完成 PCB 布线，把控 EMC/EMI、信号完整性（SI）、电源完整性（PI）设计规范，确保硬件可制造性、可测试性； 3.负责硬件样件的焊接、调试、测试与问题定位，包括单板测试、联调测试，解决研发及试产阶段的硬件故障，输出测试报告与问题整改方案； 4.协同嵌入式软件工程师完成 HSI、结构工程师完成 HMI 、协同完成系统联调，保障硬件与软件、结构的兼容性，推动产品从样件到小批量试产、量产的落地；。 5.负责EMC /EMI 电磁兼容性的设计与测试以及相关问题的Debug、输出整改报告； Your qualifications： 1. Bachelor's degree or above, major in electronics, power electronics or communication engineering, proficient in C language, 5 years or more experience in embedded hardware research and development is preferred; 2. Proficient in embedded hardware core circuit design and verification, including power circuit (LDO/DCD/PMU), MCU/ARM/FPGA minimum system, interface circuit UART/I2C/SPI/CAN/LIN/Ethernet/USB, analog circuit, etc., with the ability to independently design single board hardware; ， 3. Proficient in hardware design tools such as Zuken, Altium Designer, Cadence, etc., able to independently complete schematic drawing and PCB review, familiar with multi-layer board design process; 4. Familiar with various types of embedded component selection, including MCU, sensors, RF devices, passive devices, etc., understand the specifications, reliability, and supply chain situation of components, and be able to make cost-effective selection according to product needs; 5. Master hardware debugging methods and tool usage, such as oscilloscopes, multimeters, signal generators, logic analyzers, network analyzers, etc., able to independently locate and solve various hardware power on, communication, power supply and other faults; 6. Possess good document writing skills, able to output schematic diagrams in a standardized manner BOM、 Technical documents such as design specifications and test reports; 7. Have good learning ability and analytical problem-solving skills; 1.本科及以上学历，电子、电力电子或通信工程等相关专业， 精通C语言，5年及以上嵌入式硬件研发经验优先； 2.熟练掌握嵌入式硬件核心电路设计和验证，包括电源电路（LDO/DCDC/PMU）、MCU/ARM/FPGA最小系统、接口电路UART/I2C/SPI/CAN/LIN/Ethernet/USB，模拟电路等， 具备独立设计单板硬件的能力 ；， 3.精通硬件设计工具，如 Zuken 、Altium Designer、Cadence等，能独立完成原理图绘制与 PCB 评审，熟悉多层板设计流程； 4.熟悉各类嵌入式元器件选型，包括 MCU、传感器、射频器件、无源器件等，了解元器件的规格参数、可靠性、供应链情况，能根据产品需求做高性价比选型； 5.掌握硬件调试方法与工具使用，如示波器、万用表、信号发生器、逻辑分析仪、网络分析仪等，能独立定位并解决硬件上电、通信、电源等各类故障； 6.具备良好的文档编写能力，能规范输出原理图、BOM、设计说明、测试报告等技术文档； 7.具有良好的学习能力和分析解决问题能力；