Chief Technology Officer (CTO) / Senior Manager, Optical Packaging Engineering

We are seeking a visionary Chief Technology Officer (CTO) or Senior Optical Packaging Engineer to lead the advancement of our polymer-based optical packaging technologies. This strategic leadership role is central to driving innovation in high-performance optical module design, automation, and process development. The successful candidate will spearhead core R&D initiatives, manage cross-functional engineering teams, and play a key role in scaling Lessengers’ manufacturing capabilities in alignment with our global business goals.

This role is ideal for a technical leader who thrives in a fast-paced, entrepreneurial environment and is

passionate about pioneering next-generation packaging solutions for high-speed optical communication

systems.

Technology Leadership & Development

• Lead the development of polymer-based optical packaging technologies with a strong focus on

process automation, precision assembly, and scalability.

• Define and oversee technical strategy across packaging design, prototyping, and transition to volume

manufacturing.

• Act as a key contributor in the development and optimization of high-precision alignment and

assembly processes for photonic devices.

Team Building & Mentorship

• Mentor and train engineering teams in advanced optical packaging techniques using proprietary tools

and processes.

• Build a high-performance engineering culture driven by innovation, collaboration, and continuous

improvement.

• Provide leadership at the Gwangju site (preferably as its General Manager), setting direction and

ensuring effective operational execution.

Cross-Functional Collaboration

• Partner with the product development and manufacturing teams to translate design concepts into

manufacturable solutions.

• Lead technical communication and reporting activities, including the preparation of documentation

for customers, industry partners, and internal stakeholders.

Quality & Standards Compliance

• Ensure engineering practices meet Lessengers’ Quality Management System and safety standards.
• Promote rigorous testing, calibration, and validation of packaging processes and optoelectronic

assemblies.

• Proven experience in optical packaging processes, including:
• Fiber array attachment to photonic devices
• High-precision alignment, warpage control, and laser coupling
• Characterization of optoelectronic devices and silicon photonic ICs
• Hands-on experience in developing scalable packaging routines and automation protocols.
• Strong understanding of photonic integration and process engineering in a production or prototyping

environment.

• Ph.D. in Optical Engineering, Photonics, Materials Science, or related discipline with 5+ years of

industry experience.

• Background in multi-disciplinary teams involving optics, electronics, and automation.
• Familiarity with photonic packaging in communication systems and datacenter interconnects.
• Experience with optical simulation, mechanical modeling, and systems-level design.
• Excellent time and project management skills with a strong execution track record

What We Offer

• Strategic leadership role in a company pioneering high-performance optical transceiver technologies

for AI/HPC markets.

• Opportunity to shape the future of photonic packaging innovation and contribute to global

• technology leadership.
• A collaborative, engineering-driven culture committed to solving complex challenges with creativity and speed.