Plasma R&D Process Engineering - Dry Etch / PECVD (all genders) // Job-ID: 228-1

Silicon Austria Labs (SAL) - In the network of science and industry, SAL... 1 Plasma R&D Process Engineering - Dry Etch / PECVD (all genders) // Job-ID: 228-1 The SAL MicroFab is looking for a motivated Plasma R&D Process Engineer with focus on Dry Etch and PECVD to join the team. As an R&D Process Engineer, you will take on challenging and responsible tasks with corresponding decision-making scope. You will work independently across all required activities, continuously expand your skill set, and contribute to the growing success of the team. Your tasks include: * Develop, optimize, and sustain plasma etch (dry etch) & deposition (PECVD) processes to support diverse R&D flows. * Establish stable, repeatable process baselines and maintain tight control through SPC and regular performance monitoring. * Own and maintain plasma tools, ensuring high uptime and process consistency. * Define and document process parameters, recipes, and best practices to ensure reproducibility across experiments and flows. * Collaborate with the process engineering team members to ensure process compatibility across the full fabrication flow. * Lead troubleshooting, root cause analysis and continuous improvement activities to maintain high process quality and tool uptime. * Support tool upgrades, new equipment acquisition, and capability expansion projects. Your profile * Master's degree (Bachelor's degree with equivalent relevant experience) in Materials Science, Physics, Electrical Engineering, or related field. * Minimum 3 years of experience as a plasma process engineer in an industrial or applied research semiconductor FAB; 5+ years preferred. * Hands-on experience with plasma etch systems (e.g., ICP, RIE, PECVD). * Proven ability to establish robust and transferable etch processes supporting multiple technologies. * Proven experience with methodologies - process control, SPC, Problem Solving, CIP, Lean, equipment maintenance principles, etc. * Demonstrated ability to work effectively in a research-driven environment supporting multiple stakeholders. * Excellent teamwork, communication, reporting, and organizational skills. * Analytical, detail-oriented, and proactive in driving process and equipment improvements. * Willingness to relocate to Villach, Austria. Important Facts about SAL * Diverse research activities with many technical challenges. * State-of-the-art laboratory facilities and equipment. * Location in the heart of Europe in Austria * Internal and external training opportunities for career development. * Home office in Austria (max. 40%) and work from anywhere in the European Union possible ( Das Mindestentgelt für die Stelle als Plasma R&D Process Engineering - Dry Etch / PECVD (all genders) // Job-ID: 228-1 beträgt 3.963,00 EUR brutto pro Monat auf Basis Vollzeitbeschäftigung.